Jaskaran Singh Dhiman

About

I'm a Staff Engineer in Operations Engineering – NPI – Advanced Packaging at Kulicke & Soffa Industries (NASDAQ: KLIC) I lead new product introduction efforts for thermocompression bonding systems(TCB) used in AI Chips and HBM chip packaging, including a dual-head platform that delivers ~1.7x throughput gains and an atmospheric plasma oxide removal process enabling flux-free bonding at ultra micron micron pitch. I also built K&S's Digital Build Plan, the company's standard prototype-to-production documentation system, and run a standing design-review gate for manufacturability and GD&T compliance. I write on operations engineering and Design for Excellence (DfX) for Semiconductor Digest and Manufacturing Engineering/SME, and serve as a paper reviewer for IEOM Society International. I'm available to comment on: semiconductor manufacturing and advanced packaging (thermocompression and hybrid bonding, HBM/AI chip packaging); operations engineering and new product introduction (NPI); design for manufacturability, GD&T, and engineering documentation systems; and industry trends in AI hardware and chip supply chains.