Bryon Moyer

Key Takeaways: Foundries have been doing backend work for advanced packages. OSATs are now taking that on. This particularly affects 2.5D and panel assembly with new equipment and materials. Hybrid bonding is mostly a foundry activity now but will likely ... See more

Key Takeaways: Agentic AI, reasoning models, mixture-of-expert architectures, and reservoir computing are changing how AI workloads use compute resources. Agentic AI is particularly popular, and because it requires more CPU, CPU supply is coming under pre... See more

What it is, why it’s important, and how it’s being used. AI has created a crisis in the data center. The amount of data that needs to be processed and stored has pushed compute and memory density far beyond what anyone thought possible even a few years ag... See more

Molding compounds and underfill can improve thermal stability. Key Takeaways: Thermally induced warpage, caused by differences in the rate at which materials expand when heated, is becoming increasingly problematic in large chips and packages. The solutio... See more

RRAM, MRAM have promising futures, while FeRAM lurks, and UltraRAM plans a debut. Key Takeaways: Newer nonvolatile memory (NVM) technologies are poised to take over from flash in embedded applications on newer process nodes. Magnetic RAM (MRAM) and resist... See more